Leadership Team
Harit Doshi (CEO and founder)
Funding
$ 4.5M
Graduation Date
September 2020
Fields
Advanced Materials
Hardware Devices
Licensing
About
Omniply leverages a unique substrate delamination method that allows any high performance, high resolution thin film electronic devices to be fabricated on flexible substrates.
Press Corner
Article: CES 2020 Climate Change Innovator
Article: Funding by SDTC & Canadian Accelerators
Achievement: Garage+ Member
Article: Winner of 2019 Emerging Entrepreneurs Contest