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TandemLaunch
Portfolio
Leadership Team
Harit Doshi (CEO), Humaira Taz (Founder)
Funding
$ 2M
Graduation Date
September 2020
Omniply
Social
Fields
Advanced Materials
Hardware Devices
Licensing
About

Omniply leverages a unique substrate delamination method that allows any high performance, high resolution thin film electronic devices to be fabricated on flexible substrates.

Press Corner

Article: CES 2020 Climate Change Innovator
Article: Funding by SDTC & Canadian Accelerators
Achievement: Garage+ Member
Article: Winner of 2019 Emerging Entrepreneurs Contest